The semiconductor industry is a critical sector underpinning global technological innovation and social infrastructure. Within this industry, the accurate measurement of warpage and thermal deformation in materials, substrates, and packages serves as a fundamental manufacturing benchmark that dictates the success of design, production, and reliability assessment.

Having spent over 30 years at the forefront of the semiconductor field, I have become convinced that “accurately measuring warpage can transform the future of semiconductors.”

Cobranchor Inc. is the first company in the world to commercialize a measurement service utilizing a 3D-DIC system—equipped with advanced algorithms and capable of high-precision thermal deformation measurement under real-world conditions—that was developed through 30 years of research at Binghamton University (State University of New York).

Leveraging Japan’s renowned precision manufacturing capabilities and drawing upon the diverse measurement and application development needs arising domestically, we aim to extend our services to the global market.

We offer more than just warpage measurement; we provide “insights.” By interpreting measurement data to determine material properties such as elastic moduli and expansion coefficients, we facilitate the optimization of structures, materials, and processes. These insights hold the potential to inform upstream design phases, effectively establishing a new “yardstick” for semiconductor manufacturing.

A tailwind carries you far; a headwind lifts you high.

Cobranchor is committed to moving forward—regardless of the wind—and contributing to the future of the semiconductor industry.Our comprehensive suite of professional services caters to a diverse clientele, ranging from homeowners to commercial developers.